School of Electrical Engineering & Computer Science, Ohio University,
Athens, Ohio, USA
Guidelines for Submission
Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.
Papers should be formatted according to the guidelines for authors (see: http://www.sciencepublishinggroup.com/journal/guideforauthors?journalid=129). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.
The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.
Please download to know all details of the Special Issue
The quest for smaller multifunctional elements of devices has increasingly allured the interest in quantum phenomena at the nanoscale. The development, design and implementation of novel methods and techniques to self-assemble zero- and one-dimensional new-generation nanostructures and composites, and thin films, conducive to new technology are still a critical challenge in materials science. This special issue is thus focused on the significant breakthroughs in this research field advancing innovative miniaturization strategies to control and devise the size, shape, structure and composition of nanostructures, nanocomposites, thin films and superlattices, and tuning their corresponding interfacial interactions. This special issue also covers a comprehensive examination of the correlation between their geometry and properties, and provides the current status of the most emerging potential applications. This special issue offers a unique forum and international platform for researchers in academia and industry to widely disseminate and discuss their knowledge with experts in this field.