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Residual Stress Measurement in Micro-region Using Digital Image Correlation Method
Volume 4, Issue 3-1, June 2015, Pages: 29-32
Received: Mar. 29, 2015; Accepted: Jul. 15, 2015; Published: Sep. 2, 2015
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Yanjie Li, School of Civil Engineering and Architecture, University of Jinan, Jinan, China
Guang Han, School of Civil Engineering and Architecture, University of Jinan, Jinan, China
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The residual stress of the zirconia film on a stainless steel substrate is measured using the digital image correlation (DIC) method. A lattice structure is milled by focused ion beam (FIB) and used as the deformation carrier. An annular groove is etched by FIB in order to release the residual stress. The DIC method is used to calculate the deformation caused by the release of residual stress and the residual stress is derived by mechanics equations. The results demonstrate that this method can be extended for micro-region residual stress measurement of other thin films on substrates.
Digital Image Correlation (DIC), Focused Ion Beam (FIB), Residual Stress
To cite this article
Yanjie Li, Guang Han, Residual Stress Measurement in Micro-region Using Digital Image Correlation Method, Optics. Special Issue: Optical Techniques for Deformation, Structure and Shape Evaluation. Vol. 4, No. 3-1, 2015, pp. 29-32. doi: 10.11648/j.optics.s.2015040301.17
Tang W, Deng L J, Xu K W, et al. X-ray diffraction measurement of residual stress and crystal orientationin Au/NiCr/Ta films prepared by plating. Surface & Coatings Technology, 2007, 201:5944-5947.
Yang F, Fei W D, Gao Z M, et al. An alternative micro-area X-ray diffraction method for residual stress measurement of Pb(Zr,Ti)O3 film. Surface & Coatings Technology, 2007, 202: 121-125.
Kang Y L, Qiu Y, Lei Z K, et al. An application of Raman spectroscopy on the measurement of residual stress in porous silicon.Optics and Lasers in Engineering, 2005, 43: 847-855.
Zhu W L, Zhu J L, Nishino S, et al. Spatially resolved Raman spectroscopy evaluation of residual stresses in 3C-SiC layer deposited on Si substrates with different crystallographic orientation. Applied Surface Science, 2006, 252: 2346-2354.
Sabate N, Vogel D, Gollhardt A, et al. Residual stress measurement on a MEMS structure with high-spatial resolution. Journal of Microelectromechanical Systems, 2007, 16(2):365-372.
Sabate N, Vogel D, Gollhardt A, et al. Digital image correlation of nanoscale deformation fields for local stress measurement in thin films. Nanotechnology, 2006, 17(20):5264-5270.
Sabate N, Vogel D, Gollhardt A, et al. Measurement of residual stresses in micromachined structures in a microregion. Applied physics letters, 2006, 88:071910.
Massl S, Keckes J, Pippan R. A new cantilever technique reveals spatial distributions of residual stresses in near-surface structures. Scripta materialia, 2008, 59(5):503-506.
Korsunsky A, Sebastiani M,Bemporad E. Residual Stress Evaluation at the Micrometer Scale: Analysis of Thin Coatings by FIB milling and Digital Image Correlation. Surface and Coatings Technology, 2010, 205(7):2393-2403.
Korsunsky A, Sebastiani M, Bemporad E. Focused ion beam ring drilling for residual stress evaluation. Materials Letters, 2009, 63(22):1961-1963.
Sebastiani M, Eberl C, Bemporad E, et al. Depth-resolved residual stress analysis of thin coatings by a new FIB-DIC method. Materials Science & Engineering A, 2011, 528(27):7901-7908.
Zhu J G, Xie H M, Li Y J, et al. Interfacial Residual Stress Analysis of Thermal Spray Coatings by Miniature Ring-Core Cutting Combined with DIC Method. Experimental Mechanics, 2014, 54(2): 127-136.
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